Bambu Lab ABS Refill - High-Performance Technical Filament (no spool)

The Bambu Lab ABS - Refill It is an acrylonitrile butadiene styrene (ABS) engineering filament designed for applications requiring mechanical strength, dimensional stability, and thermal durability. With its excellent heat resistance and superior mechanical properties, this material is the ideal choice for the production of functional components, stressed mechanical parts, and technical prototypes intended for real-world use.

Main Features

Bambu Lab's ABS stands out for its Exceptional thermal resistance , with a heat deflection temperature of 87°C, allows for the creation of functional objects capable of withstanding heat and everyday stresses. The material offers superior strength, hardness, and shock absorption compared to PLA and PETG, making it perfect for products subjected to intense mechanical stress.

The coil is compatible with the AMS system by Bambu Lab thanks to the integrated RFID chip, which allows for automatic material recognition and optimization of printing parameters. The spool material itself is made of PC + ABS, resistant to temperatures up to 90°C.

Technical Specifications

Parameter	Value
Material	ABS (Acrylonitrile Butadiene Styrene)
Color	Black (Nero)
Filament diameter	1.75 mm
Net weight	1 kg
Nozzle temperature	240-270 °C
Plate temperature	80-100°C (recommended 90-100°C)
Printing speed	< 300 mm/s
Retraction length	0.8-1.4 mm
Retraction speed	20-40 mm/s
Cooling fan	0-80%
Room temperature	45-60°C (for closed printers)
Maximum overhang angle	~70°
Maximum bridge length	~40 mm

Mechanical Properties

Ideal Applications

This filament is perfect for functional and mechanical parts , components subject to thermal or mechanical stress, functional technical prototypes, supports and brackets for electronics, durable bodies and parts intended for everyday use in demanding environments.

Press Tips

Before printing, it is essential dry the filament Using a forced-dry oven at 80°C for 8 hours, or on the heated platen of X1 series printers at 90-100°C for 12 hours. Humidity during printing and storage should be kept below 20% RH with desiccant.

The use of is recommended Engineering Plate, High Temperature Plate or Textured PEI Plate As a print surface, apply glue to the bed to ensure optimal adhesion. For printers with a closed enclosure, maintain the chamber temperature between 45-60°C to reduce warping.