Ultrafuse PC GF30 contains 30% specialty glass fibers designed for filament manufacturing and 3D printing. Due to its high thermal deflection temperature and good dimensional stability, Ultrafuse PC GF30 is the right material to use in an industrial environment where good temperature resistance and high strength are needed.

Characteristics:

• Flame class V0
• UV resistance
• Good temperature resistance
• Flame retardant
• High rigidity and resistance
• Good heat deflection temperature
• High dimensional stability
• Very low moisture absorption

PC Ultrafuse GF30

Ultrafuse PC GF30 contains 30% specialty glass fibers designed for filament manufacturing and 3D printing. Due to its high thermal deflection temperature and good dimensional stability, Ultrafuse PC GF30 is the right material to use in an industrial environment where good temperature resistance and high strength are needed.

Internal and external applications

Its V0 flame class makes PC GF30 the perfect solution for applications in the transport sector. Ultrafuse® PC GF30's UV light resistance and low moisture absorption make it usable for interior and exterior applications.

Tips and tricks

• Nozzle temperature; 280-330°C
• Bed temperature; 80-100°C
• Change bed; PC sticker
• Drying procedure; Dry the filament at 100°C for at least 5 hours
• Nozzle diameter; ≥ 0.6 mm
• Printing speed; 30-60 mm/sec

Material properties

• Tensile Strength (MPa): 36.1 (XY), 11.2 (ZX)
• Elongation at break (%): 2.4 (XY), 1.1 (ZX)
• Flexural modulus (MPa): 2690 (XY), 3450 (XZ), 934 (ZX)
• Charpy impact resistance without notch (kJ/m2): 17.1 (XY) , 18.9 (XZ) , 3.7 (ZX)
• Izod impact resistance without notch (kJ/m2): 13.9 (XY) , 17.8 (XZ) , 3.4 (ZX)
• HDT @ 0.45 MPa: 134°C

BASF quality control

The best available raw materials are selected from renowned suppliers. Production on state-of-the-art computer-controlled machinery ensures truly consistent filament, even across colors and batches. It will work as expected every time.

All BASF products are 100% traceable back to the source.