Ultrafuse PA was developed specifically for 3D printing and is based on BASF's polyamide portfolio known as Ultramid. The filament has unique mechanical properties due to its chemical structure. This makes it suitable for a wide range of applications operating in a wider temperature range.

Characteristics :

• Good fatigue resistance
• The low melting point makes it printable for many FFF printers
• Good wear/lubrication resistance

PA Ultrafuse

Ultrafuse PA is suitable for a wide range of applications operating in a wider temperature range than regular PA filament. BASF's Ultramid grades are molding compounds based on PA6, PA66 and various copolyamides such as PA6/66. Ultramid is known for its high mechanical strength, stiffness and thermal stability.

In addition, Ultramid offers good low-temperature toughness. Due to its excellent properties, this material has become indispensable in almost all areas of engineering for a wide range of different machine components and elements, as a high-quality electrical insulating material and for many special applications.

With Ultrafuse PA it is possible to print thin semi-flexible parts, however it is very rigid in higher thicknesses. It has a lower melting temperature than PA6 and PA66, so it can be printed at lower temperatures and has better impact resistance than PA6 and PA66, which opens up a new field of application for end users. Depending on the specific needs, the formulation can be further optimized and special filaments can be created.

Tips and Tricks:

• Nozzle temperature: 220-250 °C
• Bed temperature: 90-120 °C
• Nozzle diameter: ≥ 0.4mm
• Bed modification: glass + PVA glue stick/Kapton tape
• Printing speed: 30-60mm/s

BASF Quality Control

BASF Quality ControlThe best available raw materials are selected from renowned suppliers. Production on state-of-the-art, computer-controlled machinery ensures a truly consistent filament, even between colors and batches. It will perform as expected every time.

All BASF products are 100% traceable back to the source.